Molecular Dynamics Study of Alumina Nanoparticles' Effects on Silicon Bicrystal Amorphization at Varying Temperatures and External Shear Stresses
نویسندگان
1 Department of Mechanical Engineering, Isfahan University of Technology, 84156-83111, Isfahan, I.R. IRAN
2 Department of Mechanical Engineering, Isfahan University of Technology, 84156-83111, Isfahan, I.R. IRAN
3 Department of Mechanical Engineering, Isfahan University of Technology, 84156-83111, Isfahan, I.R. IRAN
4 Department of Mechanical Engineering, Amirkabir University of Technology (Tehran Polytechnic), 15916-34311, Tehran, I.R. IRAN
doi
10.30492/ijcce.2025.2056507.7054چکیده
This study investigates the effects of alumina nanoparticles on the amorphization process of silicon bi-crystals using molecular dynamics simulations. The simulations, conducted with the LAMMPS package, model a bi-crystal system containing 1620 atoms within a 129×180×7.5 ų box, employing the TERSOFF potential for silicon and the Lennard-Jones potential for interactions between silicon and alumina nanoparticles. The simulation process consists of two stages: an equilibrium phase at temperatures ranging from 200 to 600 K for 1 ns, followed by an amorphization phase under external shear stresses from 1.55 to 2.50 GPa for another 1 ns. Key findings include the achievement of equilibrium after 1 ns at 300 K, with potential energy and mean atomic stress converging to -2.89 eV and 47.83 MPa, respectively. Amorphization is induced by shear stress, with the amorphization length increasing from 5.26 Å at 300 K and 1.55 GPa to 5.98 Å at 600 K and 2.50 GPa. Alumina nanoparticles serve as nucleation sites, significantly promoting the amorphization process by enhancing dislocation density and structural disorder. These results indicate that nanoparticles provide a more effective means of controlling amorphization compared to adjustments in temperature and shear stress, with potential applications in semiconductor device fabrication and solar cell manufacturing. The presence of nano-alumina slows the progression of the amorphization process. Consequently, under identical conditions—including temperature, applied external shear stress, and time—the rate of dislocation formation decreases, resulting in approximately 20% fewer dislocations overall. Additionally, the yielding stress threshold of a single crystal has increased from 8.2 to 12.8 GPa, indicating a significant enhancement in the material's resistance to deformation under applied stress.